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  • NEW PRODUCT INTRODUCTION


    As developers and manufacturers oversee the R&D and planning services for their NPI, we are committed to working hand-in-hand with the team to deliver test solutions to the highest degree. Our robust software development team offers unparalleled expertise. Together, we can minimize the product’s time to market with the highest efficiency, and enable you to get the best return on your investment with maximum productivity. We offer experience, reliability, and flexibility.


    Case Study 1


    Linear Technology, a renowned analog IC manufacturer, was looking for a cost-effective solution to test an IC module package at cold and hot temperature ranging from -60°C to 150°C. This was for a low volume production and they were doing hand testing at hot and cold temperatures. They wanted to automate the process for less than $100K.


    With its flexible platform and the latest integrated controller, the SIA-118 was the ideal solution for this demanding and stringent requirement. What may have taken weeks of testing was now possible in less than a day and better accuracy, efficiency, and productivity. Furthermore, the SIA-118 can be easily upgradable in the event the production requirement calls for higher volumes. This is how customers can make future proof IC test handler investments by choosing the SIA-118 handler.


    Having a solution of this nature at such a budget was unheard of in the past. SESSCO is fully committed to making tri-temperature IC testing for both standard and custom IC packages truly affordable without sacrificing features and performance.


    Case Study 2


    Before the acquisition of Fairchild Semiconductor by On Semiconductor, we were approached to propose tri-temp handling solutions to test most of their IC packages and power modules in the development stage. With a total of four customized and convertible SIA series handlers, we managed to offer complete tri-temp handling solutions needed to accelerate product development and characterization.


    In less than a year, the project was completed with all four handlers fully qualified to handle TO, QFN, Power Modules, and IC modules at extended temperatures ranging from -60°C to +170°C degrees. This is all made possible using SESSCO UTHA (Universal Test handler Architecture) with its modular and flexible architecture optimized for custom solutions.


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